Application Notes & Technical Papers
In-depth engineering guides, design strategies, and best practices for RF filter integration.
This paper explores advanced shielding techniques and grounding configurations to maximize out-of-band attenuation. We analyze the impact of parasitic coupling in high-density PCB layouts and provide verified footprint recommendations for 1206 and 0805 case styles.
Read Full NoteAchieving optimal Return Loss (S11) in high-power applications requires precise impedance control. This guide details de-embedding procedures using Vector Network Analyzers and discusses the effects of PCB substrate dielectric constant (Dk) variation on filter performance.
Read Full NoteAs frequencies migrate to the Ka-band, component size and thermal management become critical. Learn how STARONTEC’s ultra-small LFCV series addresses the stringent rejection requirements of 5G NR bands while maintaining a minimal SMT footprint.
Read Full NoteA fundamental overview of Low Temperature Co-fired Ceramic (LTCC) technology. We compare LTCC against traditional LC and Cavity filters in terms of Q-factor, temperature stability (Tf), and mass-production reliability for mission-critical aerospace systems.
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